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MCLEAN, VA – Orders of manufacturing technology in August dropped 12% from the same month last year, totaling $360.8 million, according to t... Note Reports 20% Decline in Q3 Sales. STOCKHOLM – Note announced third-quarter sales of SEK809 million ($77.6 million), down 20% from 2023's third quarter. PCEA Names Stephan Schmidt Recipient of ...
DataED, Bestronics Formally Merge; Will Now be Called Emerald EMS
Jun 30, 2020 · SALEM, NH — Principals in DataED and Bestronics announced today the merger of the two leading global EMS providers to form Emerald Electronics Manufacturing Services (Emerald EMS). The new entity has two sites each in New Hampshire, California and China, and estimated annual revenues over $200 million.
Top 50 EMS Companies Surpassed $457B in Revenue - Circuits …
Apr 10, 2023 · NEVADA CITY, CA – The top 50 EMS companies in the world accounted for $457 billion in revenue in 2022 – an increase of $40 billion from 2021, according to a report from Manufacturing Market Insider. Top 50 sales expanded dramatically from the previous year, exceeding the growth of the OEM market by more than double.
Low-Temperature Solder: Challenges, Opportunities and …
Mar 1, 2024 · Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success.
Understanding 3D AOI, What It Is, and What It Isn’t - Circuits …
Dec 1, 2013 · Figure 5. The same part in 3D. Currently, AOI systems come with different levels of 3D coverage for components and solder joints. All 3D systems still offer 2D lighting and 2D inspection. It is for the AOI programmer or the QA department to decide to what extent they’d like to deploy new technology for quality assurance.
High-Density Interconnect Technology: An Overview - Circuits …
Feb 1, 2024 · View the Digital Edition Here! High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics industry, providing the dense interconnections and intricate circuitry needed to create state-of-the-art electronic devices that are tightly packed with miniaturized components and 2.5-D/3-D semiconductor packages.
Koh Young Debuts Zenith Alpha 3-D AOI - Circuits Assembly
Published: 03 October 2019. Zenith Alpha 3-D automated optical inspection (AOI) incorporates a “Smart and Dynamic” feature set, plus quality optimization technologies. Collects, analyzes and manages data in real-time to dynamically formulate a multifaced view of the assembly process. Provides reliable 3-D measurement and supports KSMART ...
Defining Acceptable Voiding Levels Under QFNs - Circuits Assembly
Aug 20, 2019 · Two QFNs with different levels of voiding under the central termination. FIGURE 2 shows the void calculation made by the x-ray system on the two QFNs in Figure 1. The calculations indicate the QFN on the left has total voiding under the central pad of ~30%. The QFN on the right has just over 50% voiding under the central pad, thereby exceeding ...
This amount was applied in the tin/lead experiment. For a no-clean, alcohol flux of 1.5 percent solids, the amount to apply on the test board is: Area board = 100 * 160 mm2 = 24.8 in2. Amount of (wet) flux per board = solid content flux * area * required amount dry flux = 100/1.5 * 24.8 * 0.0016 = 2.645 g.
Clarifying Through-Hole Fill Levels - Circuits Assembly
Oct 22, 2019 · At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...