Semiconductor Engineering19h
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration ...
Semiconductor Engineering11h
Monolithic Vs. Heterogeneous Integration
New processes, materials, and combinations of existing technologies will determine future directions for semiconductors.
Semiconductor Engineering22h
New Approach to Encoding Optical Weights for In-Memory Photonic Computing Using Magneto-Optic Memory Cells
A new technical paper titled “Integrated non-reciprocal magneto-optics with ultra-high endurance for photonic in-memory ...
Semiconductor Engineering10h
The Growing Imperative Of Hardware Security Assurance In IP And SoC Design
As these technologies become increasingly pervasive, the importance of hardware security assurance in the design and ...
Semiconductor Engineering19h
Luminary Panel Sees Multi-Beam Mask Writers And Curvilinear Masks Key To 193i And EUV
Attendance was up and the mood was optimistic at this year’s SPIE Photomask and EUV conference held September 29 through ...
Semiconductor Engineering10h
Multi-Tier Die Stacking Enables Efficient Manufacturing
Maintaining precise alignment across multiple layers of stacked dies is critical for ensuring electrical connectivity and ...
Semiconductor Engineering10h
Tuning Design And Process For High-NA EUV Stitching
Additional process variation creates challenges at the boundary between two mask exposures.
Semiconductor Engineering11h
New Approaches To Power Decoupling
Strategic placement of decoupling capacitors and regulators is critical to keeping power stable, but no one approach is ...
Semiconductor Engineering10h
Reduce Augmented Reality Device Time-to-Market by Bringing Manufacturing Impact to Optical Simulation
Challenges encountered during the design and manufacturing of advanced optical components for AR systems, as well as the ...
Semiconductor Engineering19h
Overview Of Security Verification Methodologies for SoC Designs Pre-Silicon (U. of Florida)
A technical paper titled “A Survey on SoC Security Verification Methods at the Pre-silicon Stage” was recently published by ...
Semiconductor Engineering22h
Characterizing Defects Inside Hexagonal Boron Nitride (KAIST, NYU, et al.)
A new technical paper titled “Characterizing Defects Inside Hexagonal Boron Nitride Using Random Telegraph Signals in van der ...
Semiconductor Engineering10h
Revolutionizing IC Packaging With High-Density RDL Technology
This demand has been further accelerated by the COVID-19 pandemic, pushing the boundaries of silicon technology to its limits. Enter Amkor’s S-SWIFT, a packaging solution designed to address these ...