Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.
San Francisco — The IC industry faces a chip design “interconnect crisis,” experts warned at last week's IEEE International Solid-State Circuits Conference. The shift toward true 3-D packaging ...
Advanced packaging that’s no bigger than the die itself brings together high performance and high reliability with small size and low cost. Not so long ago, defense and aerospace applications were the ...
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