TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...

Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...

http://www.coolinnovations.comAs dissipated heat loads continue to rise, engineers seek increasingly efficient heat sinks. The efficiency of various heat sink ...

Available in footprints from 2.0 x 2.0 in. to 5.0 x 5.0 in. and heights from 0.7 to 2.0 in., a line of aluminum heat sinks uses a novel flared pin-fin design that minimizes friction to improve natural ...

Developed by Malaysian scientists, the proposed multi-level aluminum fin heat sinks (MLFHS) were found able to reduce the module operating temperature by up to 8.45 degrees Celsius and increase power ...

Researchers at the Manisa Celal Bayar University in Turkey have proposed using a skived-type aluminum heat sink (HS) to cool insulated gate bipolar transistor (IGBT) arrays in solar PV inverters.