EDN

MagnaChip to Include Specialty High Density Capacitor Processes With Its Standard CMOS Mixed Signal Process

The high density metal-insulator-metal capacitor process provides capacitance values of 4, 6, 8, and 10fF/um(2). This process replaces the industry standard silicon nitride insulator layer with a high ...
Design-Reuse

Enhanced Capacitor Cross Coupled Front-End

This paper presents two approaches to improve the performance of RF low noise amplifiers (LNAs) and downconversion mixers. One approach is for noise enhancement and the other is for improving flatness ...
EDN

Analog CMOS supports precision specs

Many new portable applications call for higher levels of integration and low power, along with highly integrated digital and analog electronics, requiring low-power electronics to extend battery life ...
Electronics Weekly

TI introduces bipolar CMOS process

TI introduces bipolar CMOS processNews from E-InSiteTexas Instruments (TI) has announced a SiGe complementary bipolar-CMOS manufacturing process that the company claims is the first to integrate both ...
Design-Reuse

Latch-up Improvement For Tap Less Library Through Modified Decoupling Capacitors Cells

CMOS technology has evolved as the top choice for chip manufacturers. There are multiple reasons for its emergence to its current status, continuous reduction in feature size being one of them. SoC ...
Electronic Design

8-in. Wafers For High-End Analog CMOS Process Cut Cost, Boost Performance

The HPA07 high-performance CMOS semiconductor process from Texas Instruments will foster development of advanced analog chips, including analog-to-digital and digital-to-analog converters, op amps, ...