Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way ...

TEOS 3D offers ultra-thick inter-die gapfill by leveraging bowed wafer handling and advancements in dielectric deposition.

Called the Vector TEOS 3D, Lam said the tool will be required for applications like AI and high-performance computing (HPC) ...

TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and high-performance computing applications.

Electric Rain Inc. today announced the release of Swift 3D LW, a new plug-in for NewTek’s LightWave 3D software. The plug-in provides the ability to render 3D content directly to various vector-based ...